Crystal method of luminous dipolar chip and its structure
This invention provides a method for fixing crystals of a LED wafer and its structure, in which, when a LED wafer and a base are connected, supersonic waves are used to ionize the surface of the two solder materials to let the wafer and the base become good radiators at the low temperature operation...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | This invention provides a method for fixing crystals of a LED wafer and its structure, in which, when a LED wafer and a base are connected, supersonic waves are used to ionize the surface of the two solder materials to let the wafer and the base become good radiators at the low temperature operation condition when they are fixedly connected. |
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