Economic miniaturized construction technique and connection technique for LED's and other opto-electronic modules

Economic miniaturized construction technique and connection technique for LED's and other opto-electronic modules

The device has a substrate (2) with an optoelectronic component (3) that is contacted in a planar manner. The substrate has a conducting element (7), especially a conducting track. The substrate and the optoelectronic component are at least partly coated with an insulating coating (5) on which a pla...

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Bibliographische Detailangaben
1. Verfasser: GUENTHER EWALD,SORG JOERG-ERICH,WEIDNER KARL,ZAPFJOERG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:The device has a substrate (2) with an optoelectronic component (3) that is contacted in a planar manner. The substrate has a conducting element (7), especially a conducting track. The substrate and the optoelectronic component are at least partly coated with an insulating coating (5) on which a planar conducting structure (6) is arranged for planar contacting of the optoelectronic component. An independent claim is also included for a method of manufacturing an inventive product.