Exhaust gas treating method for semiconductor and photoelectric process

The method of treating tail gas from semiconductor and photoelectronic production process includes activating water into plasma state, and utilizing the plasma with high temperature and free radicals of H and O to react and destroy toxic waste gas and contained halide to form low toxicity or no toxi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: NIANHONG GUO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The method of treating tail gas from semiconductor and photoelectronic production process includes activating water into plasma state, and utilizing the plasma with high temperature and free radicals of H and O to react and destroy toxic waste gas and contained halide to form low toxicity or no toxicity gas. The method has short waste gas treating time and low cost.