Electronic packaging materials for use with low-k dielectric-containing semiconductor devices

Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.

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Bibliographische Detailangaben
1. Verfasser:	TODD MICHAEL G.,HUNEKE JAMES T.,CRANE LAWRENCE N.,FISCHER GORDON C
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.