Chemical vaporization-coating device

A chemical vapor deposition apparatus is provided to uniformly form deposition layers by increasing a flow length of each nozzle hole in a nozzle unit progressively from a center axis line to an outside of a semi-diameter direction of the nozzle hole. A reactor(30) comprises a reactive chamber(31) h...

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Bibliographische Detailangaben
1. Verfasser: KUL GWANG JOON,ANDRIY YUSHAKOV,WU CHENGTAI,CHEONGGYONG SACK,CHEONG HWA CHUN
Format: Patent
Sprache:eng
Schlagworte:
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Zusammenfassung:A chemical vapor deposition apparatus is provided to uniformly form deposition layers by increasing a flow length of each nozzle hole in a nozzle unit progressively from a center axis line to an outside of a semi-diameter direction of the nozzle hole. A reactor(30) comprises a reactive chamber(31) having a gas inlet hole(33). A reactive gas is supplied to an upper portion of the gas inlet hole. A support(70) supports a target in the reactive chamber. A shower head(40) sprays the reactive gas to the target from the gas inlet hole. The shower head has a nozzle unit(50) where plural nozzle holes(51) are formed. A flow length of a center axis line of the nozzle hole is shorter than an outside of a semi-diameter direction thereof. Outlet ends(55) of the nozzle holes are uniformly separated from the support. Inlet ends(53) of the nozzle holes at the outside of the semi-diameter direction are farther from the support than the center axis line thereof.