Chemical vaporization-coating device
A chemical vapor deposition apparatus is provided to uniformly form deposition layers by increasing a flow length of each nozzle hole in a nozzle unit progressively from a center axis line to an outside of a semi-diameter direction of the nozzle hole. A reactor(30) comprises a reactive chamber(31) h...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A chemical vapor deposition apparatus is provided to uniformly form deposition layers by increasing a flow length of each nozzle hole in a nozzle unit progressively from a center axis line to an outside of a semi-diameter direction of the nozzle hole. A reactor(30) comprises a reactive chamber(31) having a gas inlet hole(33). A reactive gas is supplied to an upper portion of the gas inlet hole. A support(70) supports a target in the reactive chamber. A shower head(40) sprays the reactive gas to the target from the gas inlet hole. The shower head has a nozzle unit(50) where plural nozzle holes(51) are formed. A flow length of a center axis line of the nozzle hole is shorter than an outside of a semi-diameter direction thereof. Outlet ends(55) of the nozzle holes are uniformly separated from the support. Inlet ends(53) of the nozzle holes at the outside of the semi-diameter direction are farther from the support than the center axis line thereof. |
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