Substrate processing system and control method thereof

The present invention provides one kind of base plate treating system and its control method. The base plate treating system includes laminated modules for treating the base plate with treating liquid, and one distributing mechanism to distribute treating liquid to the modules. The distributing mech...

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Bibliographische Detailangaben
Hauptverfasser:	OKUBO KEIHIRO, KIMURA YOSHIO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention provides one kind of base plate treating system and its control method. The base plate treating system includes laminated modules for treating the base plate with treating liquid, and one distributing mechanism to distribute treating liquid to the modules. The distributing mechanism has one treating liquid source for holding the treating liquid, one pressurizing unit for pressurizing the treating liquid, pumps for pressure conveying the treating liquid to the modules, pipes for making the treating liquid flow from the pumps to the modules, and nozzles for spraying treatedliquid. All the pumps are so configured that all the pipes for connecting each of the pump outlets to the corresponding nozzle are equal in length.