Positive photoresist and method for producing structure

Disclosed is a positive photoresist which can be developed with a low-concentration aqueous alkaline solution or neutral water and can be easily removed by ozone water. The positive photoresist hardly leave scum and enables to reduce cost and environmental damages. Also disclosed is a method for producing a structure wherein a circuit is formed by a resist pattern using such a photoresist. The positive photoresist contains a novolac resin having a benzene nucleus to which two or more hydroxyl groups are bonded and a weight-average molecular weight of 1,000-20,000. The method for producing a structure wherein a circuit is formed by a resist pattern using such a positive photoresist comprises a step for forming a resist film on the surface of a substrate using the positive photoresist, a step for developing wherein the resist film is exposed to light, a step for forming a circuit using the thus-developed resist pattern, and a step for removing the resist film.