Plating solution for electroless copper plating

A plating solution for electroless copper plating which is suitable for improving deposit film adhesion and with which an even deposit can be formed at low temperatures. The plating solution for electroless copper plating is characterized by containing a water-soluble nitrogenous polymer therein. Th...

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Bibliographische Detailangaben
1. Verfasser:	YABE ATSUSHI,SEKIGUCHI JUNNOSUKE,IMORI TORU,FUJIHIRA YOSHIHISA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A plating solution for electroless copper plating which is suitable for improving deposit film adhesion and with which an even deposit can be formed at low temperatures. The plating solution for electroless copper plating is characterized by containing a water-soluble nitrogenous polymer therein. The plating solution for electroless copper plating preferably further contains glyoxylic acid and a phosphinic acid as reducing agents. The water-soluble nitrogenous polymer preferably is polyacrylamide or polyethyleneimine each preferably having a weight-average molecular weight (Mw) of 100,000 or higher and an Mw/Mn of 10.0 or lower.