Method and apparatus for processing dielectric materials
A process method and equipment of the dielectric material, spreads the bond glue on the dielectric material layer with several perforations, the fixture loads upward, the pressing groupware above the dielectric material layer pressurizes downward and strickle the bond glue, and the de-aerating equip...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A process method and equipment of the dielectric material, spreads the bond glue on the dielectric material layer with several perforations, the fixture loads upward, the pressing groupware above the dielectric material layer pressurizes downward and strickle the bond glue, and the de-aerating equipment allures downward in order to flow the bond glue downward and infill the perforations of the dielectric material layer, spreads the bond glue on the dielectric material layer after strickling the bond glue above the dielectric material layer, forms a well-proportioned film to insure the conductive efficiency and anti-explode board, that is fit for the multilayer board techniques usage. |
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