A method of manufacturing an electronic device and an electronic device

The sensing device (100) comprises a first sensing element (10) having a reference plane (1), between which sensing element (10) and a contacting side (3) of the device (100) a predefined angle is present. Conductors couple the sensing element (10) to external contacting means (30). The sensing devi...

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Bibliographische Detailangaben
1. Verfasser:	WEEKAMP JOHANNUS W.,GORTEMAKER MARK H.,PETERS JOHN A
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS TESTING
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Beschreibung
Zusammenfassung:	The sensing device (100) comprises a first sensing element (10) having a reference plane (1), between which sensing element (10) and a contacting side (3) of the device (100) a predefined angle is present. Conductors couple the sensing element (10) to external contacting means (30). The sensing device (100) is further provided with a body (21), which encapsulates the first sensing element (10) and at the same time acts as a carrier for the conductors, so that the contacting side (3) is a face of the body (21). The sensing device (100) may contain more than one sensing element (10,20), which are by preference magneto-resistive sensors. It can be suitably manufactured in that parts (21 A, 21 B) of the body are rotated with respect to the contacting side (3), the parts of the body having complementary shapes.