Thin-film assembly and method for producing said assembly

The arrangement has a substrate and at least one electronic thin film component on a base electrode (4) on the substrate in the form of a circuit board (2) with an insulating material base body (3) and a metal lamination as a conducting coating forming the base electrode. The conducting coating is f...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	WUCHSE MARKUS,HASLEBNER NIKOLAI,FROSCH RONALD,RIEDLER MANFRED,LEISING GUENTHER
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The arrangement has a substrate and at least one electronic thin film component on a base electrode (4) on the substrate in the form of a circuit board (2) with an insulating material base body (3) and a metal lamination as a conducting coating forming the base electrode. The conducting coating is flattened at least at the thin film component's position, at which there is a thin film contact coating physically and/or chemically absorbed on the surface of the base electrode. An independent claim is also included for the following: (A) a method of manufacturing an inventive arrangement.