Electrolytic copper foil coating excellent in chemical resistance and cohesive force and its surface treatment method

This invention relates to the electrolytic copper foil coat with well chemically-resistant and combining power and its surface processing method. In the electrolytic copper foil coat, Zn takes up 65-75%, Ni takes up 20-30%, Sn takes up 3-7%. The processing method as follows: 1 preparing galvanic sol...

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Bibliographische Detailangaben
1. Verfasser:	MAOZHONG,WANG AN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING
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Beschreibung
Zusammenfassung:	This invention relates to the electrolytic copper foil coat with well chemically-resistant and combining power and its surface processing method. In the electrolytic copper foil coat, Zn takes up 65-75%, Ni takes up 20-30%, Sn takes up 3-7%. The processing method as follows: 1 preparing galvanic solution; 2 choosing adding substance; 3 preprocessing electrolytic copper foil; 4 electric depositing. The FR4 covered with copper foil pressing board pressed by the produced copper foil can obtain more than 1.9-2.0N/mm striping intensify and less than 2% acid resistance degradation rate.