Device for material processing by means of a laser beam guided by a deflecting unit comprising a piezoelectric deflector plate
The device for material processing comprises a laser source (1), for the generation of a laser beam (11), a deflecting unit (2), arranged in the beam path of the laser beam (11) with at least two mirrors (35,45), which may pivot about mirror axes (38,48), forming an angle with each other, and a focu...
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| creator | ROELANTS EDDY,DIETRICH STEFAN,MAYER HANS JUERGEN |
| description | The device for material processing comprises a laser source (1), for the generation of a laser beam (11), a deflecting unit (2), arranged in the beam path of the laser beam (11) with at least two mirrors (35,45), which may pivot about mirror axes (38,48), forming an angle with each other, and a focussing unit in the form of a lens (5). The drive units for the deflecting unit (2) are each formed by piezoelectric deflector plates (3,4), comprising polarised regions, alternately opposed by means of domain inversion, such that, on application of voltages with alternately opposed polarities, a torsion may be exerted on the free end (35,45) of each deflector plate and hence the mirror axis (38, 48). Substrates (6) such as electrical circuit substrates and circuit boards can thus be processed at extremely high rate and very accurately. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN1842393A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN1842393A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN1842393A3</originalsourceid><addsrcrecordid>eNqFjTsOwjAQBdNQIOAM7AUoIBRQogCioqKPNs5ztJJ_sh0kKDg7CYKa6hUzTzMtXkfcRYG0j2Q5IwobCtErpCSuo-ZBFuwSeU1MhhMiNWBLXS8t2pEztdAGKo9-7yST8jZE-fyZguDpMfIo6qcOtWCG3LyYaDYJi-_OiuX5dKsuKwRfIwVWcMh1dV3vtptyXx7K_8YbHfdHUA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Device for material processing by means of a laser beam guided by a deflecting unit comprising a piezoelectric deflector plate</title><source>esp@cenet</source><creator>ROELANTS EDDY,DIETRICH STEFAN,MAYER HANS JUERGEN</creator><creatorcontrib>ROELANTS EDDY,DIETRICH STEFAN,MAYER HANS JUERGEN</creatorcontrib><description>The device for material processing comprises a laser source (1), for the generation of a laser beam (11), a deflecting unit (2), arranged in the beam path of the laser beam (11) with at least two mirrors (35,45), which may pivot about mirror axes (38,48), forming an angle with each other, and a focussing unit in the form of a lens (5). The drive units for the deflecting unit (2) are each formed by piezoelectric deflector plates (3,4), comprising polarised regions, alternately opposed by means of domain inversion, such that, on application of voltages with alternately opposed polarities, a torsion may be exerted on the free end (35,45) of each deflector plate and hence the mirror axis (38, 48). Substrates (6) such as electrical circuit substrates and circuit boards can thus be processed at extremely high rate and very accurately.</description><language>eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PERFORMING OPERATIONS ; PHYSICS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061004&DB=EPODOC&CC=CN&NR=1842393A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061004&DB=EPODOC&CC=CN&NR=1842393A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ROELANTS EDDY,DIETRICH STEFAN,MAYER HANS JUERGEN</creatorcontrib><title>Device for material processing by means of a laser beam guided by a deflecting unit comprising a piezoelectric deflector plate</title><description>The device for material processing comprises a laser source (1), for the generation of a laser beam (11), a deflecting unit (2), arranged in the beam path of the laser beam (11) with at least two mirrors (35,45), which may pivot about mirror axes (38,48), forming an angle with each other, and a focussing unit in the form of a lens (5). The drive units for the deflecting unit (2) are each formed by piezoelectric deflector plates (3,4), comprising polarised regions, alternately opposed by means of domain inversion, such that, on application of voltages with alternately opposed polarities, a torsion may be exerted on the free end (35,45) of each deflector plate and hence the mirror axis (38, 48). Substrates (6) such as electrical circuit substrates and circuit boards can thus be processed at extremely high rate and very accurately.</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFjTsOwjAQBdNQIOAM7AUoIBRQogCioqKPNs5ztJJ_sh0kKDg7CYKa6hUzTzMtXkfcRYG0j2Q5IwobCtErpCSuo-ZBFuwSeU1MhhMiNWBLXS8t2pEztdAGKo9-7yST8jZE-fyZguDpMfIo6qcOtWCG3LyYaDYJi-_OiuX5dKsuKwRfIwVWcMh1dV3vtptyXx7K_8YbHfdHUA</recordid><startdate>20061004</startdate><enddate>20061004</enddate><creator>ROELANTS EDDY,DIETRICH STEFAN,MAYER HANS JUERGEN</creator><scope>EVB</scope></search><sort><creationdate>20061004</creationdate><title>Device for material processing by means of a laser beam guided by a deflecting unit comprising a piezoelectric deflector plate</title><author>ROELANTS EDDY,DIETRICH STEFAN,MAYER HANS JUERGEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN1842393A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>ROELANTS EDDY,DIETRICH STEFAN,MAYER HANS JUERGEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ROELANTS EDDY,DIETRICH STEFAN,MAYER HANS JUERGEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Device for material processing by means of a laser beam guided by a deflecting unit comprising a piezoelectric deflector plate</title><date>2006-10-04</date><risdate>2006</risdate><abstract>The device for material processing comprises a laser source (1), for the generation of a laser beam (11), a deflecting unit (2), arranged in the beam path of the laser beam (11) with at least two mirrors (35,45), which may pivot about mirror axes (38,48), forming an angle with each other, and a focussing unit in the form of a lens (5). The drive units for the deflecting unit (2) are each formed by piezoelectric deflector plates (3,4), comprising polarised regions, alternately opposed by means of domain inversion, such that, on application of voltages with alternately opposed polarities, a torsion may be exerted on the free end (35,45) of each deflector plate and hence the mirror axis (38, 48). Substrates (6) such as electrical circuit substrates and circuit boards can thus be processed at extremely high rate and very accurately.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Device for material processing by means of a laser beam guided by a deflecting unit comprising a piezoelectric deflector plate |
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