Chemical plating appts

This invention relates to a chemical plating device, which comprises one main body that can contain the plating solution, one loading unit that can load the plating parts, and at least one agitator that is placed in the inner bottom of the main body. The agitator is connected with the external drivi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	QUANDE HUANG
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	This invention relates to a chemical plating device, which comprises one main body that can contain the plating solution, one loading unit that can load the plating parts, and at least one agitator that is placed in the inner bottom of the main body. The agitator is connected with the external driving unit. The chemical plating device in this invention has such advantages as simple structure, low energy consumption, high yield and uniform plating.