Water-based polishing pads and methods of manufacture

A chemical mechanical polishing pad (300) comprises a polymeric matrix having microspheres dispersed in it. The polymeric matrix is formed of water-based polymer(s). An independent claim is included for manufacture of chemical mechanical polishing pad which involves supplying a water-based fluid pha...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	DUONG CHAU H.,JAMES DAVID B
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A chemical mechanical polishing pad (300) comprises a polymeric matrix having microspheres dispersed in it. The polymeric matrix is formed of water-based polymer(s). An independent claim is included for manufacture of chemical mechanical polishing pad which involves supplying a water-based fluid phase polymer composition containing microspheres onto a continuous transported backing layer (302), shaping the polymer composition on the backing layer into a fluid phase polishing layer (304) having preset thickness, and curing the polymer composition on the backing layer in a curing oven to convert the polymer composition to a solid phase polishing layer of the polishing pad.