Printed circuit board with embedded capacitors therein and manufacturing process thereof

Disclosed is a printed circuit board (101) having embedded capacitors therein, comprising: a double-sided copper-clad laminate including first circuit layers formed in the outer layers (102) thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers (105) formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers (106) formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates (108;109) formed on the second circuit layers; blind via-holes (111) and through-holes (110) formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes (111) and the through-holes (110). The manufacturing method of the printed circuit board is also disclosed.