Method for making wear-resistant dielectric layer
The invention firstly provides a substrate comprising plural connection pads, successively at least makes a plasma auxiliary chemical vapour deposition process to deposit a dielectric layer on the substrate surface, where the vapour deposition process is made in a high frequency-low frequency plasma...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention firstly provides a substrate comprising plural connection pads, successively at least makes a plasma auxiliary chemical vapour deposition process to deposit a dielectric layer on the substrate surface, where the vapour deposition process is made in a high frequency-low frequency plasma alternating mode, and finally makes an anisotropic etching process to form plural openings in the dielectric layer, where these openings correspond to the connection pads and side wall of each opening is inclined outward. |
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