Techniques for microchannel cooling

Techniques for heat transfer are provided. In one aspect of the invention, a heat-transfer device (200) is provided. The heat-transfer device comprises one or more microchannels (213) suitable for containing a heat-transfer fluid, one or more of the microchannels having protruding structures (214) o...

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Bibliographische Detailangaben
1. Verfasser:	HODES MARC SCOTT,KOLODNER PAUL ROBERT,KRUPENKIN THOMAS NIKITA,LEE WONSUCK,LYONS ALAN MICHAEL,SALAMON TODD RICHARD,TAYLOR JOSEPH ASHLEY,WEISS DONALD P
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Techniques for heat transfer are provided. In one aspect of the invention, a heat-transfer device (200) is provided. The heat-transfer device comprises one or more microchannels (213) suitable for containing a heat-transfer fluid, one or more of the microchannels having protruding structures (214) on at least one inner surface thereof configured to affect flow of the heat-transfer fluid through the one or more microchannels. The structures may comprise posts coated with a hydrophobic coating.