A substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same
A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90 % by weight of spherical filler.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90 % by weight of spherical filler. |
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