Evaporating device and method utilizing same

The invention discloses an evaporation equipment and the method thereof. The evaporation equipment decomposes the gas which requires high energy through plasma decomposition and heating, and decomposes the gas which requires less energy through heating; in this way, an evaporation body is developed...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KIM HAN-GI,HUH MIN-SOO,KIM MIN-SOO,LEE KUI-SUNG,CHUNG SEOK-HEON
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention discloses an evaporation equipment and the method thereof. The evaporation equipment decomposes the gas which requires high energy through plasma decomposition and heating, and decomposes the gas which requires less energy through heating; in this way, an evaporation body is developed on the substrate. When molding an insulating film with a current ICP-CVD device or a PEVCD plasma device, the source gas is difficult to be totally decomposed, which impairs the property of the evaporation body and leads to low service efficiency of the source gas. In the purpose of avoiding the above defects, the invention provides an evaporation equipment with plasma and/ or heating working modes and an evaporation method thereof.