Assembly apparatus and its manufacturing method

A module having a smaller size with enhanced reliability and productivity, and a method for fabricating the module. The module comprises a connector (6) having metal terminals for connection, and a circuit board (1) mounting electronic components. The connector (6) and the board (1) are connected to...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	EGUCHI SHUUJI,ASANO MASAHIKO,SASAKI MASAHIRO,UCHIYAMA KAORU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A module having a smaller size with enhanced reliability and productivity, and a method for fabricating the module. The module comprises a connector (6) having metal terminals for connection, and a circuit board (1) mounting electronic components. The connector (6) and the board (1) are connected to each other through metal leads (7). The surface of the connector (6) on the side being connected to the board, the metal leads 7, and the electronic components are sealed with the same thermosetting resin (9). The thermosetting resin (9) is in solid state at temperatures of 40 DEG C or below before curing, and the thickness of the thermosetting resin (9) sealing the electronic components is changed depending on the heights of the electronic components.