High surface area aluminum bond pad for through-wafer connections to an electronic package

High surface area aluminum bond pad for through-wafer connections to an electronic package

A bond pad for effecting through-wafer connections to an integrated circuit or electronic package and method of producing thereof. The bond pad includes a high surface area aluminum bond pad in order to resultingly obtain a highly reliable, low resistance connection between bond pad and electrical l...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: ADKISSON JAMES W.,GAMBINO JEFFREY P.,JAFFE MARK D.,RASSEL RICHARD J.,SPROGIS EDMUND J
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A bond pad for effecting through-wafer connections to an integrated circuit or electronic package and method of producing thereof. The bond pad includes a high surface area aluminum bond pad in order to resultingly obtain a highly reliable, low resistance connection between bond pad and electrical leads.