Environmental friendly lead-free solder and its preparation method

The invention relates to welding material, especially providing a high-temperature resistance oxidation environment-friendly leadless solder and relative preparation method. said leadless solder comprises following elements in weight percents: 2-5% AG, 0.1-2% Cu, 0.001-0.1% Ce, 0.001-0.5% Ni and Sn....

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Bibliographische Detailangaben
1. Verfasser:	SHOUYOU HUANG
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention relates to welding material, especially providing a high-temperature resistance oxidation environment-friendly leadless solder and relative preparation method. said leadless solder comprises following elements in weight percents: 2-5% AG, 0.1-2% Cu, 0.001-0.1% Ce, 0.001-0.5% Ni and Sn. Compared to present technique, the invention is environment-friendly, which can effectively avoid lead poisoning of operator and when the solder is welded in high temperature (380-500Deg. C), it has minute oxidation sludge. The invention has high-temperature resistance oxidation ability which can keep the surface of tin furnace bright without oxidation in this temperature, and the welded tin furnace can last non-oxidation condition for longer time. The invention has less welding defects compared to common Sn-Ag-Cu system, bright surface of welding point and improved welding quality.