Salicide process and method of fabricating semiconductor device using the same

Methods of forming metal silicide layers include a convection-based annealing step to convert a metal layer into a metal silicide layer. These methods may include forming a silicon layer on a substrate and forming a metal layer (e.g., nickel layer) in direct contact with the silicon layer. A step is...

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1. Verfasser: JUNG SUG-WOO,CHOI GIL-HEYUN,YUN JONG-HO,ROH KWAN-JONG,JUNG EUN-JI,KIM HYUN-SU
Format: Patent
Sprache:eng
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Zusammenfassung:Methods of forming metal silicide layers include a convection-based annealing step to convert a metal layer into a metal silicide layer. These methods may include forming a silicon layer on a substrate and forming a metal layer (e.g., nickel layer) in direct contact with the silicon layer. A step is then performed to convert at least a portion of the metal layer into a metal silicide layer. This conversion step is includes exposing the metal layer to an inert heat transferring gas (e.g., argon, nitrogen) in a convection or conduction apparatus.