Photocuring/thermosetting inkjet composition and printed wiring board using same

A photocurable and thermosetting composition for an ink jet system comprises (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in its molecule, (B) a photoreactive diluent having a weight-average molecular weight of not more than 700 other than the component (A) mentio...

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Bibliographische Detailangaben
1. Verfasser: KAKINUMA MASAHISA,KUSAMA MASATOSHI,USHIKI SHIGERU
Format: Patent
Sprache:eng
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Zusammenfassung:A photocurable and thermosetting composition for an ink jet system comprises (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in its molecule, (B) a photoreactive diluent having a weight-average molecular weight of not more than 700 other than the component (A) mentioned above, and (C) a photopolymerization initiator and has a viscosity of not more than 150 mPa·s at 25°C. A solder resist pattern is directly drawn on a printed circuit board by means of an ink jet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy ray and then further cured by heating.