Cutting processing method
The present invention relates to a kind of cutting processing method, and is especially one kind of no-burr cutting processing method. The cutting processing method includes the following steps: forming one thin layer of fragile material in the bottom of the material to be cut, cutting the material...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention relates to a kind of cutting processing method, and is especially one kind of no-burr cutting processing method. The cutting processing method includes the following steps: forming one thin layer of fragile material in the bottom of the material to be cut, cutting the material with formed fragile thin layer, and eliminating the fragile thin layer to obtain the no-burr cut material. The said fragile material includes nanometer ceramic powder material. The method of the present invention is suitable for cutting metal, plastic and other material. |
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