Electronic assembly with a heat sink

The electronic assembly, comprising a printed circuit (1) and a housing (3, 4) that provides thermal and/or electrical insulation and has a thermal drain (2, 5, 6) with an interface layer complex. The latter is located between faces of the printed circuit and housing, extending over the major part o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: DUARTE MARC,NICOLAI JEAN-MARC,MYOTTE DAVID,GOVIN FABRICE
Format: Patent
Sprache:eng
Schlagworte:
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