Electronic assembly with a heat sink

The electronic assembly, comprising a printed circuit (1) and a housing (3, 4) that provides thermal and/or electrical insulation and has a thermal drain (2, 5, 6) with an interface layer complex. The latter is located between faces of the printed circuit and housing, extending over the major part o...

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Bibliographische Detailangaben
1. Verfasser: DUARTE MARC,NICOLAI JEAN-MARC,MYOTTE DAVID,GOVIN FABRICE
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The electronic assembly, comprising a printed circuit (1) and a housing (3, 4) that provides thermal and/or electrical insulation and has a thermal drain (2, 5, 6) with an interface layer complex. The latter is located between faces of the printed circuit and housing, extending over the major part of the printed circuit surface and having an adhesive coating on each side for attaching to the printed circuit and the housing. The housing has an additional fixing in the form of a projection (9) that engages with holes (10, 11) in the interface layer and printed circuit.