Microintegration pressure sensing mould set

Microintegration pressure sensing mould set

A micro integrated pressure sensing module consists of a printed circuit board with an opening as its top set with pressure sensing element and its bottom set with the first connection unit, the first connection unit with pressure guide tube at middle for pointing to opening on printed circuit board...

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1. Verfasser: ZONGSHENG,QIU LI
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
TESTING
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creator ZONGSHENG,QIU LI
description A micro integrated pressure sensing module consists of a printed circuit board with an opening as its top set with pressure sensing element and its bottom set with the first connection unit, the first connection unit with pressure guide tube at middle for pointing to opening on printed circuit board and for transmitting pressure source pressure to be tested to pressure sensing element, and pressure sensing element. It features that semiconductor base material film is used to prepare pressure sensing element and metal film such as copper foil is used to clad periphery of opening on printed circuit board.
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subjects MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
TESTING
title Microintegration pressure sensing mould set
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