Microintegration pressure sensing mould set
A micro integrated pressure sensing module consists of a printed circuit board with an opening as its top set with pressure sensing element and its bottom set with the first connection unit, the first connection unit with pressure guide tube at middle for pointing to opening on printed circuit board...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A micro integrated pressure sensing module consists of a printed circuit board with an opening as its top set with pressure sensing element and its bottom set with the first connection unit, the first connection unit with pressure guide tube at middle for pointing to opening on printed circuit board and for transmitting pressure source pressure to be tested to pressure sensing element, and pressure sensing element. It features that semiconductor base material film is used to prepare pressure sensing element and metal film such as copper foil is used to clad periphery of opening on printed circuit board. |
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