Power interconnect device

A low profile, low inductance in-line connector for providing power from a first circuit board to a second circuit board is described. The connector includes a base section that includes a housing having an interior cavity, and first and second contacts spaced apart from each other with a first insulating member positioned in a space between the contacts. The contacts each have a linear array of a plurality of mating fingers spaced apart along their lengths. The contacts are positioned in the housing such that they are essentially parallel to each other and the mating fingers of the first contact are interdigitated with the mating fingers of the second contact. The connector also includes a mating section that includes a plurality of mating contacts spaced apart from each other along a length of the mating section. The mating section fits into the interior cavity of the housing of the base section such that the mating contacts are aligned with and connect to the mating fingers of the contacts.