Semiconductor device
A semiconductor device having a multi-layered wiring structure that prevents breakage and exfoliation of the inter-layer insulating films of the semiconductor device and realizes a high-speed, stable operation. In the semiconductor device, a wiring structure using insulating films of a high fracture...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A semiconductor device having a multi-layered wiring structure that prevents breakage and exfoliation of the inter-layer insulating films of the semiconductor device and realizes a high-speed, stable operation. In the semiconductor device, a wiring structure using insulating films of a high fracture toughness value is built in the multi-layered wiring structure, whereby the insulating films of the high fracture toughness value lessen the influence of the stress on the semiconductor device, thereby allowing the multi-layered wiring structure to prevent breakage and exfoliation of the inter-layer insulating films and realize the stable operation. |
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