Method for cleaning surface of wafer carrying mechanism of semiconductor machine

This invention relates to one surface clearing method of one semiconductor crystal load structure, wherein, the machine has one splash chamber with one crystal load bench to support crystal slice. The clear method comprises the following steps: adjusting semiconductor machine to one clear status to generate one plasma and to use the plasma ion to remove the dirty on the bench and to adjust the machine to one release status to stop generating plasma. The clear status comprises three steps: passing one protective gas to splash chamber; adding the radio power of bench onto one proper range; keeping the load radio power within one proper time. The above release status comprises two steps: adjusting the load bench radio frequency to zero; releasing protective gas.