Equipment and method for controlling encapsulating semiconductors with plastics

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Bibliographische Detailangaben
1. Verfasser:	MIYAJIMA FUMIO,KOBAYASHI KAZUHIKO,NAKAJIMA KENJI,GOTOH NAOYA,KOBAYASHI KAZUHIKO,WADA KAZURO,MAKINO HARUHISA,TAKAHASHI HARUHISA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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