Low gloss thermoformable flooring structure

A novel flooring composition was developed based on a blend comprising: a) an elastomer; b) a random propylene/alpha-olefin copolymer; c) a cross linking agent; and optionally d) a melt strength enhancing polymer. This composition achieves a unique balance of properties, exhibiting often-conflicting...

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Bibliographische Detailangaben
1. Verfasser:	WALTHER BRIAN W.,BAKER CARL F.,BAKER SHARON L.,CASSIDAY MICHAEL D.,DIEHL CHARLES F.,LIANG WENBIN,WRIGHT DAVID P
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRICITY INSULATORS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A novel flooring composition was developed based on a blend comprising: a) an elastomer; b) a random propylene/alpha-olefin copolymer; c) a cross linking agent; and optionally d) a melt strength enhancing polymer. This composition achieves a unique balance of properties, exhibiting often-conflicting performance requirements. These include low gloss and excellent pattern duplication in embossing, low modulus, minimal odor, excellent grain acceptance and abrasion resistance, while remaining thermoformable and maintaining minimal shift in viscosity during recycle.