Test structure for testing leavings in semiconductor device through-hole

The invention provides a structure for measuring the residuum of the semiconductor, which arranges a pair of finger V sharp comb type via hole. It comprises: a first group comb type via hole chain structure which uses welding plate A to connect and a second group comb type via hole chain structure which uses welding plate B to connect, wherein each group of comb type via hole chain structure comprises a plurality of via hole chains; two groups of comb type via hole chain structures interlocked with each other to form a pair of finger V sharp comb type via hole chain structure; each comb type via hole chain is formed by a first mental layer M1, a plurality of via hole layers Via 1 and a second mental layer M2.