Equipment and method for removing CMP pad from platen

The invention provides a pad removal apparatus and method that enables improved pad removal from a platen.

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Bibliographische Detailangaben
1. Verfasser:	MOLONEY GERARD,SALDANA ERNEST A.,WALSH CORMAC,LIUJUN
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention provides a pad removal apparatus and method that enables improved pad removal from a platen.