Semiconductor packaging structure having microstrip antenna structure
The invention relates to a semiconductor package structure with microband antenna structure, comprising a package substrate, a semiconductor chip and a microband radiator, where the top surface of the package substrate defines a packaging region and a peripheral region outside the packaging region,...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention relates to a semiconductor package structure with microband antenna structure, comprising a package substrate, a semiconductor chip and a microband radiator, where the top surface of the package substrate defines a packaging region and a peripheral region outside the packaging region, and the microband radiator is arranged in the peripheral region to receive and transmit a wireless signal on the semiconductor chip. |
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