Method of manufacturing package substrate with fine circuit pattern using anodic oxidation
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| creator | MAENG DUCK Y.,SUN BYUNG K.,KIM TAE H.,MOK JEE S.,BAE JONG S.,OH YOONG,SONG CHANG-KYU,CHO SUK-HYEON |
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| format | Patent |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Method of manufacturing package substrate with fine circuit pattern using anodic oxidation |
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