Method of manufacturing package substrate with fine circuit pattern using anodic oxidation

Bibliographische Detailangaben

1. Verfasser:	MAENG DUCK Y.,SUN BYUNG K.,KIM TAE H.,MOK JEE S.,BAE JONG S.,OH YOONG,SONG CHANG-KYU,CHO SUK-HYEON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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