Double-sided polishing apparatus

An upper polishing plate (50) is moved downward until facing a lower polishing plate (32) to polish a work piece (26). The upper polishing plate (50) is rotated in a horizontal plane together with a first elastic member (70), a second elastic member (72) and an outer member (65). A pressure differen...

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Bibliographische Detailangaben
1. Verfasser:	NAKAJIMA MAKOTO,NAKAMURA YOSHIO,MIYASHITA TADAKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	An upper polishing plate (50) is moved downward until facing a lower polishing plate (32) to polish a work piece (26). The upper polishing plate (50) is rotated in a horizontal plane together with a first elastic member (70), a second elastic member (72) and an outer member (65). A pressure difference between a first pressing force pressing the outer member (65) or an inner member (64) upward and a second pressing force pressing the outer member (65) or the inner member (64) downward, which is produced in a first closed space (73) by supplying a compressed fluid into and discharging the same from the first closed space (73), is adjusted, so that a third pressing force of the upper polishing plate (50), which presses a work piece (26), can be adjusted.