Electronic component unit

An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill. The present invention is an electronic part device in which a semiconductor element (flip chip) ( 3 ) is mounted on a wiring circuit substrate ( 1 ) under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) ( 3 ) and a circuit electrode ( 5 ) disposed on the wiring circuit substrate ( 1 ) are facing with each other. In addition, the gap between the wiring circuit substrate ( 1 ) and the semiconductor element (flip chip) ( 3 ) is filled by a filling resin layer ( 4 ) comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C). (A) A liquid epoxy resin. (B) A curing agent. (C) An N,N,N',N'-tetra-substituted fluorine-containing aromatic diamine compound. (D) A carboxylic acid vinyl ether addition product.