Ultra high speed uniform plasma processing system

An apparatus for processing a substrate with a plasma. The apparatus includes first (22) and second (24) electrodes positioned with a spaced apart relationship. A separating ring (26) has a vacuum-tight engagement with confronting surfaces of the first electrode and the second electrode to define an...

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Bibliographische Detailangaben
1. Verfasser:	CONDRASHOFF ROBERT S.,FAZIO JAMES P.,GETTY JAMES D.,TYLER JAMES S
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An apparatus for processing a substrate with a plasma. The apparatus includes first (22) and second (24) electrodes positioned with a spaced apart relationship. A separating ring (26) has a vacuum-tight engagement with confronting surfaces of the first electrode and the second electrode to define an evacuatable processing region therebetween. Communicating with the processing region is a process gas port for introducing a process gas to the processing region. The processing region may be evacuated through a vacuum port defined in one of the first and second electrodes to a pressure suitable for exciting a plasma from the process gas in the processing region when the first and second electrodes are powered.