Method of leaking stoppage by electroplating in electro vacuum device

The invention relates to a method to plating for stopping leak in electric vacuum component that includes the following step: preparing for material; identifying the location of leak hole; using the electric vacuum component as cathode, platinum wire adhering plating liquid as anode; connecting the...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YUNXIN,YU LU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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