Method of leaking stoppage by electroplating in electro vacuum device
The invention relates to a method to plating for stopping leak in electric vacuum component that includes the following step: preparing for material; identifying the location of leak hole; using the electric vacuum component as cathode, platinum wire adhering plating liquid as anode; connecting the...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | The invention relates to a method to plating for stopping leak in electric vacuum component that includes the following step: preparing for material; identifying the location of leak hole; using the electric vacuum component as cathode, platinum wire adhering plating liquid as anode; connecting the power supply between cathode and anode with 6V voltage; grating the platinum wire around the leak hole for 2-3 minutes; finishing stopping leak. The invention is an effective and convenience method. |
|---|