Method for reducing contact defects in semiconductor cells

A method and system for providing at least one contact in a semiconductor device. The semiconductor device includes a substrate, an etch stop layer, an interlayer dielectric on the etch stop layer, an anti-reflective coating layer on the interlayer dielectric, and at least one feature below the etch stop layer. A resist mask having an aperture and residing on the anti-reflective coating layer is provided. The aperture is above an exposed portion of the anti-reflective coating layer. The method and system include etching the exposed anti-reflective coating layer and the underlying interlayer dielectric without etching through the etch stop layer, thereby providing a portion of at least one contact hole. The method and system also include removing the resist mask in situ, removing a portion of the etch stop layer exposed in the portion of the contact hole, and filling the contact hole with a conductive material.