Housing for electronic ballast

An electronic housing assembly is formed with an environmental seal (20), EMI control (56) and a good thermal coupling (44, 46) made between enclosed hot electric components (48, 50) and an exterior heat sink (52, 54).

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Bibliographische Detailangaben
1. Verfasser:	BOUCHARD GUY P.,SANROMA JOHN P.,JOHNSON ANDREW O.,HOLDEN RUSSELL R
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	An electronic housing assembly is formed with an environmental seal (20), EMI control (56) and a good thermal coupling (44, 46) made between enclosed hot electric components (48, 50) and an exterior heat sink (52, 54).