Method for coating base plate in tandem equipment

Coating a substrate (5) in inline installations comprises: forming a model of the coating chamber (2), which takes into consideration those changes of chamber parameters, which are caused by the movement of the substrate through the coating chamber; acquiring the position of the substrate within the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ELBERT KASTNER, ANDREAS FRUG, JURGEN BRUCH, BERND CITSKA, MICKEL GESNER, TOMAS LIPNITS
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Coating a substrate (5) in inline installations comprises: forming a model of the coating chamber (2), which takes into consideration those changes of chamber parameters, which are caused by the movement of the substrate through the coating chamber; acquiring the position of the substrate within the coating chamber is acquired; and setting the chamber parameters are set based on the position of the substrate according to the model.