Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers

Bibliographische Detailangaben

Hauptverfasser:	HASEGAWA KOU, OKAMOTO TAKAHIRO, MIYAUCHI HIROYUKI, SHIHO HIROSHI, KAWAHASHI NOBUO, HOSAKA YUKIO
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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