Copper-nickel-silicon two phase quench substrate

A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructu...

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Bibliographische Detailangaben
Hauptverfasser:	BYE RICHARD L, MYOJIN SHINYA, WOLSH D. R, MILLURE DAVID W, LIN J. S, DECRISTOFARO NICHOLES J, SCHUSTER GARY A, KECSH J. G
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CASTING CASTING OF METALS CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY FERROUS OR NON-FERROUS ALLOYS FORGE FURNACES FORGING HAMMERING MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METALLURGY PERFORMING OPERATIONS POWDER METALLURGY PRESSING METAL PUNCHING METAL RIVETING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.